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LCB3399pro System On Module SoM With OTG1 HOST2 TYPE-C*2

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LCB3399pro System On Module SoM With OTG1 HOST2 TYPE-C*2

Name: LCB3399pro System On Module SoM With OTG1 HOST2 TYPEC2
Brand: Neardi
Price: 1 USD

Wholesale LCB3399pro System On Module SoM With OTG*1 HOST*2 TYPE-C*2 from china suppliers

Brand Name : Neardi

Model Number : LCB3399pro

Place of Origin : Shanghai, China

MOQ : 1 piece

Price : Negotiable

Payment Terms : L/C,D/A,D/P,T/T

Supply Ability : 10000/pieces/mon

Delivery Time : 7 days

Packaging Details : 33.5×19×9 cm

SoC : RK3399Pro

Supplier Type : OEM/ODM

CPU : 2 * Cortex-A72 + 4 * Cortex-A53

GPU : Mali-T860MP4 GPU

NPU : 3 TOPS

VPU : 4K/1080P

DDR : LPDDR4, 3GB/6GB (Optional)

eMMC : eMMC 5.1, 16GB/64GB (Optional)

Working Temperature : Enterprise Grade: -20°C to 70°C; Industrial Grade: -40°C to 85°C

PCB interface : B2B, 240 Pin

Embedded : Yes

OS : Android / Ubuntu / Buildroot / Debian

Application : Smart Home and Retail

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LCB3399pro System On Module SoM with OTG*1,HOST*2,TYPE-C*2

The LCB3399Pro is a high-performance core module engineered around Rockchip’s RK3399Pro platform, featuring a compact 75mm × 55mm design. It connects to the baseboard through two Tyco/AMP 0.8mm pitch dual-row 140-pin board-to-board connectors and is secured with four M3 screws, ensuring a stable, reliable connection that simplifies installation and maintenance.

This module integrates key components, including a CPU with an NPU, LPDDR3 RAM, eMMC storage, and a PMU. The RK3399Pro processor powers the system, while dual-channel LPDDR3 (64-bit) memory enhances performance with lower power consumption and support for 3GB/6GB configurations. The eMMC 5.1 standard provides high-speed storage, ranging from 4GB to 128GB. Power management is handled by the RK809 PMU, along with multiple DC-DC converters and LDO components, supporting DVFS (Dynamic Voltage and Frequency Scaling) for optimized power efficiency.

To ensure long-term reliability, the LCB3399Pro undergoes rigorous testing, covering:

• Power performance (voltage accuracy, ripple, overshoot, rise/fall time, dynamic range)

• Power sequencing of various voltages

• Clock signal accuracy and frequency deviation

• Full-load power consumption and temperature rise

Designed with a modular architecture, the LCB3399Pro serves as a fully functional, pre-validated core module, allowing businesses to build products efficiently while minimizing development time, cost, and risk. This approach accelerates mass production and enhances overall project success.

Product Parameters

Function	Description
CPU	RK3399Pro; dual-core Cortex-A72 + quad-core Cortex-A53 architectural processor.
GPU	Mali-T860MP4 GPU, supporting OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DirectX 11; supports AFBC (Advanced Frame Buffer Compression).
NPU	3 TOPS computational power; supports 8-bit/16-bit operations; compatible with TensorFlow and Caffe models.
VPU	Capable of 4K VP9 and 4K 10-bit H265/H264 video decoding, up to 60fps at 1080P; multi-format video decoding (WMV, MPEG-1/2/4, VP8); 1080P video encoding, supporting H.264 and VP8 formats
DDR	LPDDR4/LPDDR4X, with options for 3GB or 6GB.
eMMC	eMMC 5.1, with options for 16GB,64GB
PMU	RK806
Camera Interface	Two ISP built-in Dual MIPI-CSI 4 Lane of 1.5 Gbps/Lane ITU-R BT 601/656 compliant Maximum input resolution of one ISP is 14M pixels
Display Interface	Two VOP embedded Dual MIPI-DSI 4 Lane of 1.5 Gbps/Lane up to 2560x1600@60fps eDP1.3 4 Lane of 2.7/1.62 Gbps/lane DP1.2 4 Lane with HDCP2.2 up to 4kx2k at 60Hz resolution HDMI2.0 3 Lane with HDCP2.2
USB Interface	OTG1,HOST2,TYPE-C*2
TYPE-C Interface	Dual Type-C PHY with Type-C V1.1 and USB PD2.0 Attach/detach detection and signaling as DFP, UFP, and DRP Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode Up to 5Gbps data rate for USB3.0 Up to 5.4Gbps (HBR2) data rate for DP1.2
Audio Interface	Three I2S/PCM built-in SPDIF supported Audio resolution from 16 bits to 32 bits Sample rate up to 192KHz Provides master and slave work mode, software configurable Support 3 I2S formats (normal, left-justified, right-justified) Support 4 PCM formats (early, late1, late2, late3) Support two 16-bit audio data stores together in one 32-bit wide location Support 16, 20, 24 bits audio data transfer in linear PCM mode
Connectivity	Compatible with SDIO 3.0 protocol GMAC 10/100/1000M Ethernet Controller Six on-chip SPI controllers Five on-chip UART controllers inside Nine on-chip I2C controllers Five groups of GPIO (GPIO0~GPIO4), totally have 122 GPIOs One PCIe port compatible with PCI Express V2.1 and dual operation mode (RC and EP), Six-channel single-ended 10-bit SAR-ADC up to 1MS/s sampling rate
OS	Android / Ubuntu / Buildroot / Debian
PCB interface	B2B(280 Pin 0.8mm Pitch)
PCB size	L* W H(mm):75 55 * 7.8(PCB thickness 1.2mm)

Developer's Must-Read!

Welcome to our Resource Center, where you can find various helpful links and information for developers.

Please visit the corresponding Wiki documentation link to obtain detailed information about the product of your choice, including the following: Hardware information: Specifications, components, and technical parameters of the product, and debugging Methods: Common troubleshooting steps and debugging techniques. Interface Information: Available interfaces and their functional descriptions.Firmware Programming: Guidance on firmware updates and programming processes. Compiling SDK: Detailed instructions for compiling and configuring the SDK.Linux and Android Development: Development guidelines and best practices for Linux and Android environments.

Wiki Documentation:	http://wiki.neardi.net/docs/welcome
GitHub:	https://github.com/neardiGitLab: https://gitlab.com/neardiSDK
Repository:	https://gitlab.com/neardi-linux
Forum:	https://forum.neardi.com
Video Tutorials:	https://www.youtube.com/@neardichannels

Company Introduction

Shanghai Neardi Technology Co., Ltd. was established in 2014, focusing on the field of intelligent electronic products, providing customers with one-stop solutions for design and production. The company adheres to the strategy of technological innovation and professional service, integrates the technical precipitation and industry experience of Neardi Technology, helps partners to introduce products to the market quickly and efficiently, effectively saves customers' time and resources, and becomes the product accelerator of partners.

LCB3399pro System On Module SoM With OTG*1 HOST*2 TYPE-C*2

After-sale Service Policy

1. Please take a valid purchasing voucher for maintenance requests when you have product failure problems.
2. We kindly provide one year of warranty to the ARM board except for non-warranty components(CPU, RAM, and Flash/ storage chips) and a three-month warranty to display and power adapter from the ex-factory date.
3. Product failure in expired time, we kindly provide paid maintenance service. Charges depend on the assessment by the maintenance department. If goods are seriously damaged, the accessory is discontinued, or other uncontrollable conditions may cause the products can not be fixed, Neardi will not provide maintenance service.
4. Neardi kindly provides one month of warranty for the repaired items, payment should be made to the appointed account. Note: This warranty is only valid for the repaired problem.
5. Please take necessary data backup before the defective item is sent back up for maintenance, all risks caused by no backup should be borne by customers.
6. Neardi will reject items sent back without our permission.
7. For goods within the warranty period, freight should be shared by both sides, otherwise, the customer should bear all maintenance-related freight and customs fees.
Non-warranty Coverage(Paid Maintenance Service):
1. Products out of warranty period;
2. Non-warranty components including CPU, RAM, and Flash chips;
3. Failure caused by improper operations like PCB short circuit, rupture;
4. The bar code or factory ID is tampered with or other operations cause the products can not be recognized;
5. The bar code or factory ID on the purchasing voucher is not matched with the product itself;
6. Product failure caused by unauthorized maintenance, improper operations, misuse operations, or other unexpected behaviors.
7. Product failure caused by force majeure.
8. Other failures caused during delivery.

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